10cc Flux Líquido Flux Soldadura Electrónica Chip BGA Componente Rework Reballing Reflow Amarillo Semi Transparente Baja Viscosidad

Descripción

FÁCIL DE COMENZAR: Debido a la fluidez del flujo de líquido, ideal para microsoldadura incluso para técnicos sin experiencia PARA REFLEJO: El P23 es

Flux

Fundente diseñado para microsoldadura y reballing o reflujo BGA. CS-FLUX es un flujo de baja viscosidad diseñado por el equipo de investigación de C.

cs-flux Reballing baja viscosidad componente de flujo líquido para BGA Rework reflujo 15 g. Ideal para reparaciones de VGA GPU

CS-FLUX when heated at around 150 degrees (Celsius) turns into liquid and covers the small gap between the BGA component and the PCB completely. This way all solder balls are covered with CS-FLUX and during reflow or removal of the BGA components all PCB and component pads and balls are protected from oxidation. CS-FLUX is no clean flux and causes no corrosion if not cleaned, but if needed it can be cleaned very easily with alcohol. It causes no corossion on the PCB or components.

CS Labs CS-FLUX Reballing Low Viscosity halogen-free Liquid Flux for BGA Component Rework Reflow 15g Ideal for VGA GPU Repairs

Las mejores ofertas en Flujo de Soldadura Industrial Líquido

CS-FLUX when heated at around 150 degrees (Celsius) turns into liquid and covers the small gap between the BGA component and the PCB completely. This

CS-FLUX reballing Low viscosity Halogen-free liquid flux for BGA component rework reflow 15g . Ideal for VGA GPU repairs

Flux Para Soldar Tipo Rma-223 10cc Pcb Pga Bga Smd - VENSUMELEC

Flux R-868-LO 10cc

Liquid Solder Flux - Solder Paste, Solder Flux - FCTA México

Las mejores ofertas en Flujo de Soldadura Industrial Líquido

FÁCIL DE COMENZAR: Debido a la fluidez del flujo de líquido, ideal para microsoldadura incluso para técnicos sin experiencia PARA REFLEJO: El P23 es

10cc Flux Líquido Flux Soldadura Electrónica Chip BGA Componente Rework Reballing Reflow Amarillo Semi Transparente Baja Viscosidad

CS-FLUX when heated at around 150 degrees (Celsius) turns into liquid and covers the small gap between the BGA component and the PCB completely. This way all solder balls are covered with CS-FLUX and during reflow or removal of the BGA components all PCB and component pads and balls are protected from oxidation. CS-FLUX is no clean flux and causes no corrosion if not cleaned, but if needed it can be cleaned very easily with alcohol. It causes no corossion on the PCB or components.

Computer-systems CS-FLUX Reballing Low Viscosity halogen-free Liquid Flux for BGA Component Rework Reflow 10g . Ideal for VGA GPU Repairs

KESTER 186

ROSIN FLUX 3.4 fl oz. Soldadura de flujo líquido de soldadura sin flujo de colofonia limpio, ideal para soldar componentes eléctricos

€ 4.50EUR
puntaje 4.8(98)
En stock
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